Amkor Technology, Inc.
Health
Performance
9.6
Risk
Sell
Buy
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Amkor Technology, Inc. stock rating and score history

All changes in ratings, performance and outlook tracked over time.

17.07.2026
Still winning, but momentum’s cooling a bit.
03.07.2026
Losing steam. Solid pieces remain, but cracks are showing.
02.07.2026
Red alert. Risk levels out of control.
20.08.2025
Climbing out. Risks fading, but not out of the woods.
AMKR
Amkor Technology, Inc.
66.73
+6.67%
9.6
Sell
Buy
Amkor Technology, Inc.

Amkor Technology, Inc. stock price, chart patterns and momentum

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What does Amkor Technology, Inc. do? Business model and key facts

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Amkor Technology, Inc. Profile

Sector: Technology

Industry: Semiconductors

Employees (FY): 30800

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

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Company facts
Kevin K. Engel
CEO
30800
Employees worldwide
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Performance
204.01%
Last 12 months
188.75%
Last 5 years
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Growth
$6.71B
Revenue year
$376.12M
Net income
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Valuation
$15.60B
Market Cap
26.15
Price/Earnings Ratio

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Events and news impacting Amkor Technology, Inc. stock

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Amkor Technology, Inc. fundamentals and technical analysis

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